Advertisment
Advertisment
Promo

Breaking open the Apple iPhone 3G

By Bill Detwiler on 15 July 2008, 1:00pm

Read Full Review

With both EMI shields removed, we can see the chips used in the iPhone 3G. Apple used components from Intel, Samsung, ARM, SST, Skyworks, TriQuint Semiconductor, and Infineon for the iPhone 3G.

You Might Like These

Anonymous User Avatar

To get an avatar and username, log in or register

Anonymous User

Your email address must be entered but will not be displayed

Copy the letters and numbers to prove you're a human being. If you can't read this image, get another one. If you don't want to do this each time, register.

Random characters

All submitted content becomes the sole property of CBS Interactive and may be used, edited or rejected at CBS Interactive's sole discretion. You acknowledge that you, not CBS Interactive, are responsible for the contents of your submission. -- see Terms of Use

Advertisment